RFQ Now For EDI9M1512C55-S8187 with NSN 5962-01-334-3573 of White Electronic Designs Corporation
We’re excited to announce that part number EDI9M1512C55-S8187 is now available in our ready-to-ship inventory. Part number EDI9M1512C55-S8187 is a Microcircuit Memory manufactured by White Electronic Designs Corporation with FSC 5962 Microcircuits Electronic. Are you interested in a quick and competitive quote for this part? If so, just fill out the short Request for Quote (RFQ) form below to get started.
As you fill out the RFQ form, make sure that you carefully complete all fields, especially the asterisk-marked (*) fields like Need Parts By and Quantity (ea) for the NSN part EDI9M1512C55-S8187. A majority of your quote will be determined by your response to these fields. One of our dedicated sales representatives will get back to you with your quote in 15 minutes or less after receiving your RFQ for EDI9M1512C55-S8187.
ASAP NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of White Electronic Designs Corporation hard-to-find parts for the aerospace, aviation, and defense industries. We’re an AS9120B, ISO 9001:2015, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). With our vast and comprehensive inventory of over 2 billion parts sourced from over 5000 global manufacturers and our many advanced shipping facilities, we can get you the White Electronic Designs Corporation NSN parts you need at the fastest delivery times in the industry with same-day and next-day delivery.
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NSN Information for Part Number EDI9M1512C55-S8187 with NSN 5962-01-334-3573, 5962013343573
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-334-3573 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013343573 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| EDI9M1512C55-S8103 | 5 | 9 | 3 |
Characteristics Data of NSN 5962-01-334-3573, 5962013343573
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.680 INCHES NOMINAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAT | BODY WIDTH | 0.480 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.225 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 40.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 INPUT PICOFARADS MAXIMUM AND 16.00 OUTPUT PICOFARADS MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM DELAY |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 29 PIN |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS |
| CQSZ | INCLOSURE CONFIGURATION | AXIAL QUAD ARRAY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ABKW | OVERALL HEIGHT | 0.380 INCHES NOMINAL |
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