RFQ Now For HMC241QS16 with NSN 5962-01-576-5546 of Hittite Microwave Corporation

Part Number : HMC241QS16
Item Name : microcircuit linear
CAGE Code : 1cn88

We’re excited to announce that part number HMC241QS16 is now available in our ready-to-ship inventory. Part number HMC241QS16 is a Microcircuit Linear manufactured by Hittite Microwave Corporation with FSC 5962 Microcircuits Electronic. Are you interested in a quick and competitive quote for this part? If so, just fill out the short Request for Quote (RFQ) form below to get started.

As you fill out the RFQ form, make sure that you carefully complete all fields, especially the asterisk-marked (*) fields like Need Parts By and Quantity (ea) for the NSN part HMC241QS16. A majority of your quote will be determined by your response to these fields. One of our dedicated sales representatives will get back to you with your quote in 15 minutes or less after receiving your RFQ for HMC241QS16.

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ASAP NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of Hittite Microwave Corporation hard-to-find parts for the aerospace, aviation, and defense industries. We’re an AS9120B, ISO 9001:2015, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). With our vast and comprehensive inventory of over 2 billion parts sourced from over 5000 global manufacturers and our many advanced shipping facilities, we can get you the Hittite Microwave Corporation NSN parts you need at the fastest delivery times in the industry with same-day and next-day delivery.

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NSN Information for Part Number HMC241QS16 with NSN 5962-01-576-5546, 5962015765546

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-576-5546

Item PartTypeName:

MICROCIRCUIT,LINEAR

59620157655460NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
10354558596

Characteristics Data of NSN 5962-01-576-5546, 5962015765546

MRCCriteriaCharacteristic
CXCYPart Name Assigned By Controlling AgencyGAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ
FEATSpecial FeaturesPACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND
MRCDecoded RequirementClear Text Reply

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